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www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 1/ 31 11.nov.2014 rev.002 tsz22111 ? 14 ? 00 operational amplifiers low noise operational amplifiers ba 2107g ba21 15xx x general description the ba2107/ba2115 are single and dual operational amplifier with high gain and high slew rate(4v/s). the ba2107/ba2115 have good performance of input referred noise voltage (7 hz nv/ ) and total harmonic distortion(0.008%). these are suitable for audio applications. features ? high voltage gain ? low input referred noise voltage ? low total harmonic distortion ? wide operating supply voltage application ? audio application ? potable equipment ? consumer electronics key specification ? wide operating supply voltage (split supply): 1.0v to 7.0v ? operating temperature range: - 40 c to +85c ? slew rate: 4 v/ s (typ) ? total harmonic distortion : 0.008%(typ) ? input referred noise voltage : 7 hz nv/ (typ) packages w(typ)xd(typ) xh(max) ssop5 2.90mm x 2.80mm x 1.25mm sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1. 65 mm msop8 2.90mm x 4.00mm x 0.90mm simplified schematic product structure silicon monolithic integrated circuit this product is not designed protection against radioactive ray s. figure 1. simplified schematic in in vout vcc vee out vcc - in +in vee datashee t downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 2/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx 4 5 3 6 2 7 1 8 ch1 - + ch2 + - out1 -in1 +in1 vee out2 -in2 +in2 vcc pin configuration ssop5 pin no. pin name 1 +in1 2 vee 3 -in1 4 out 5 vcc sop8, sop-j8, msop8 pin no. pin name 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc package ssop5 sop8 sop- j8 msop8 ba2107g ba2115f ba2115fj ba2115fvm ordering information b a 2 1 x x x x x - x x part number ba2107g ba2115xxx package g : ss op 5 f : sop8 fj : sop-j8 f vm : msop8 packaging and forming specification e2: embossed tape and reel (sop8/sop-j8) tr: embossed tape and reel (ssop5/msop8) line- up operating temperature range operating supply voltage (split supply) supply current (typ) slew rate (typ) package orderable part number -40c to +85c 1.0v to 7.0v 3.5ma 4v/s ssop5 reel of 3000 ba2107g- tr sop8 reel of 2500 ba2115f- e2 sop- j8 reel of 2500 ba2115fj- e2 msop8 reel of 3000 ba2115fvm- tr 3 4 2 1 5 +- out +in - in vee vcc downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 3/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx absolute maximum ratings (t a =25 ) ba 2107, ba 2115 parameter symbol ratings unit supply voltage vcc- vee + 14 v power dissipation p d ssop5 0.67 (note 1, 4) w sop8 0. 78 (note 2,4) sop- j8 0.67 (note 1, 4) msop8 0.59 (note 3,4) differential input voltage (note 5) c + 14 v input common-mode voltage range v icm (vee -0.3) to (vee+14) v input current (note 6) i i - 10 ma operating supply voltage v opr 2 to 14(1 to 7) v operating temperature t opr - 40 to +85 storage temperature t stg - 55 to 150 maximum junction temperature t jmax + 150 (note 1) to use at temperature above t a 25 reduce 5.4mw/ (note 2) to use at temperature above t a 25 reduce 6.2mw/ (note 3) to use at temperature above t a 25 reduce 4.8mw/ (note 4) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area le ss than 3%). (note 5) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. (note 6) an excessive input current will flow when input voltages of mor e than v cc +0.6v or less than v ee -0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 4/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx electric al characteristics ba21 07 (unless otherwise specified vcc=+2.5v, vee=-2.5v, t a =25 ) parameter symbol limits unit condition min typ max input offset voltage (note 7) v io - 1 6 mv vout=0v, v icm =0v input offset current (note 7) i io - 2 200 na vout=0v, v icm =0v input bias current (note 8) i b - 150 400 na vout=0v, v icm =0v supply current i cc - 1.8 3.0 ma av=0db, r l = , +in=0v maximum output voltage(high) v oh 4.5 4.8 - v r l R 2.5k , v oh min =vcc-0.5v - 11.6 - r l R 10k , vcc=12v , vee=0v v rl =6v, v oh =vcc-0.4v - 15.5 - r l R 10 k , vcc=16v , vee=0v v rl =8v, v oh =vcc-0.5v maximum output voltage(low) v ol 0.5 0.2 - v r l R 2.5k , v olmin =vee+0.5v - 0.4 - r l R 10k , vcc=12v , vee=0v v rl =6v, v ol =vee+0.4v - 0.5 - r l R 10k , vcc=16v , vee=0v v rl =8v, v ol =vee+0.5v output source current i sou rce - 1.4 - ma - output sink current i sink - 90 - ma - large signal voltage gain av 60 80 - db r l R 10k , vout=2.52v v icm =2.5v input common-mode voltage range v icm 1.5 - - v ( vee +1.0v ) - (vcc-1.0v) common-mode rejection ratio cmrr 60 74 - db v icm =-1.5v to +1 .5v power supply rejection ratio psrr 60 80 - db vee=0v, vcc=2v to 16v slew rate sr - 4 - v/s av=0db, +in=2v p-p gain bandwidth product gb w - 12 - mhz f=10khz unity gain frequency f t - 3.4 - mhz 0db cross frequency input referred noise voltage v n - 7 - hz nv/ r s =600 , din-audio - 0.9 - vrms r s =600 , din-audio total harmonic distortion thd +n - 0.008 - av=20db, f=1khz, din-audio (note 7) absolute value (note 8) current direction: since first input stage is composed with pnp transistor, input bias current flows out from ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 5/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba2115 (unless otherwise specified vcc=+2.5v, vee=-2.5v, t a =25 ) parameter symbol limits unit condition min typ max input offset voltage (note 9) v io - 1 6 mv vout=0v, v icm =0v input offset current (note 9) i io - 2 200 na vout=0v, v icm =0v input bias current (note 10 ) i b - 150 400 na vout=0v, v icm =0v supply current i cc - 3.5 5 ma av=0db, r l = , all op-amps +in=0v maximum output voltage(high) v oh 4.5 4.8 - v r l R 2.5k , v oh min =vcc-0.5v - 11.6 - r l R 10k , vcc=12v , vee=0v v rl =6v, v oh =vcc-0.4v - 15.5 - r l R 10k , vcc=16v , vee=0v v rl =8v, v oh =vcc-0.5v maximum output voltage(low) v ol 0.5 0.2 - v r l R 2.5k , v olmin =vee+0.5v - 0.4 - r l R 10k , vcc=12v , vee=0v v rl =6v, v ol =vee+0.4v - 0.5 - r l R 10 k , vcc=16v , vee=0v v rl =8v, v ol =vee+0.5v output source current i source - 1.4 - ma - output sink current i sink - 90 - ma - large signal voltage gain a v 60 80 - db r l R 10k , vout=2v v icm =0v input common-mode voltage range v icm 1.5 - - v ( vee +1.0v ) - ( vc c-1.0v) common-mode rejection ratio cmrr 60 74 - db v icm =-1.5v to +1.5v power supply rejection ratio psrr 60 80 - db vee=0v, vcc=2v to 14v slew rate sr - 4 - v/s av=0db, +in= 2v pp gain bandwidth product gb w - 12 - mhz f=10khz unity gain frequency f t - 3.4 - mhz 0db cross frequency input referred noise voltage v n - 7 - hz nv/ r s =600 , din-audio - 0.9 - vrms r s =600 , din-audio total harmonic distortion thd +n - 0.008 - av=20db, f=1khz, din-audio channel separation cs - 100 - db av=4 0db (note 9) absolute value (note 10 ) current direction: since first input stage is composed with pnp transisto r, input bias current flows out from ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 6/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx description of electrical characteristics described below are descriptions of the relevant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning may differ from those on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage i n excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (v cc / v ee ) indicates the maximum voltage that can be applied betwee n the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteri stics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deteriora tion or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings do es not assure normal operation of ic. for normal operation, use t he ic within the input common-mode voltage range ch aracteristics. ( 4) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient tem perature 25 (normal temperature). as for package product, pd is dete rmined by the temperature that can be permitted by the ic i n the package (maximum junction temperature) and the thermal resis tance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting te rminal and inverting terminals. it can be translated into th e input voltage difference required for setting the output volt age at 0 v. (2) input offset current (i io ) indicates the difference of input bias current between the non-inv erting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input term inal. it is defined by the average of input bias currents a t the non-inverting and inverting terminals. (4) supply current (i cc ) indicates the current that flows within the ic under specified no-loa d condition s. (5) maximum output voltage(high) / maximum output voltage(low) (voh/vol) indicates the voltage range of the output under specified load condition. it is typically divided into maximum ou tput voltage high and low. maximum output voltage high indica tes the upper limit of output voltage. maximum output voltage low indicates the lower limit. (6) output source current/ output sink current (i source / i sink ) the maximum current that can be output from the ic under spe cific output conditions. the output source current indicates the current flowing out from the ic, and the output sink curre nt indicates the current flowing into the ic. indicates the current flowing out from the ic, and the output sink curre nt indicates the current flowing into the ic. (7) large signal voltage gain (av) indicates the amplifying rate (gain) of output voltage agains t the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) w ith reference to dc voltage. av = (output voltage) / (differential input voltage ) (8) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (9) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage wh en the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctua tion) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 7/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx (10) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply voltage)/(input offset fluctuation) (11) slew rate (sr) indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) gain bandwidth (gbw) the product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6db/octave. (1 3) unity gain frequency (f t ) indicates a frequency where the voltage gain of operational ampl ifier is 1. (1 4) input referred noise voltage (v n ) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (15) total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of out put voltage with reference to the change of output voltage of driven channel. (16) channel separation (cs) indicates the fluctuation in the output voltage of the driv en channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 8/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx typical performance curves ba21 07 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 2. derating curve figure 3. supply current - supply voltage figure 4. supply current - ambient temperature figure 5. output voltage - load resistance (vcc/vee=+2.5v/-2.5v) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 ambient temperature [ ] power dissipation [w] ba 2107g 85 0 1 2 3 4 0 5 10 15 supply voltage [v] supply current [ma] . - 40 25 85 -3 -2 -1 0 1 2 3 0.1 1 10 100 1000 10000 load resistance [k ] output voltage [v] 0 1 2 3 4 -50 -25 0 25 50 75 100 ambient temperature [ ] supply current [ma] 2.0v 14.0v 5.0v voh vol load resistance [k ] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 9/ 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba21 07 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 6. output voltage - supply voltage (r l =10k ) figure 7. output voltage - ambient temperature (vcc/vee=+7.0 v/ - 7. 0v, r l =10k ) figure 8. output voltage - output source current (vcc/vee=+2.5v/-2.5v) figure 9. output voltage - output sink current (vcc/vee=+2.5v/-2.5v) -10 -6 -2 2 6 10 -50 -25 0 25 50 75 100 ambient temperature [ ] output voltage [v] -10 -6 -2 2 6 10 1 2 3 4 5 6 7 8 supply voltage [v] output voltage [v] voh vol voh vol 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.4 0.8 1.2 1.6 2.0 output source current [ma] output voltage [v] -3 -2.5 -2 -1.5 -1 -0.5 0 0 2 4 6 8 10 output sink current [ma] output voltage [v] voh vol downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 10 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba21 07 (*)the above data is measurement value of typical sample, it is not guaranteed. 0 50 100 150 200 250 1 2 3 4 5 6 7 8 supply voltage [v] input bias current [na] 0 50 100 150 200 250 -50 -25 0 25 50 75 100 ambient temperature [c] input bias current [na] . figure 11. input offset voltage - ambient temperature (v icm =0v, vout=0v) figure 10. input offset voltage - supply voltage (v icm =0v, vout=0v) figure 12. input bias current - supply volt age (v icm =0v, vout=0v) figure 13. input bias current - ambient temperature (v icm =0v, vout=0v) - 40 25 85 1.0v 2.5v 7.0v -3 -2 -1 0 1 2 3 -50 -25 0 25 50 75 100 ambient temperature [c] input offset voltage [mv] -6 -4 -2 0 2 4 6 1 2 3 4 5 6 7 8 supply voltage [v] input offset voltage [mv] 1.0v 2.5v 7.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 11 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba21 07 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 14. input offset current - supply voltage (v icm =0v, vout=0v) figure 15. input offset current - ambient temperature (v icm =0v, vout=0v) figure 17. large signal voltage gain - ambient temperature (vcc/vee=+2.5v/-2.5v) figure 16. input offset voltage - common mode input voltage (vcc/vee=+2.5v/-2.5v, vout=0v) -40 -30 -20 -10 0 10 20 30 40 -50 -25 0 25 50 75 100 ambient temperature [ ] input offset current [na] -40 -30 -20 -10 0 10 20 30 40 1 2 3 4 5 6 7 8 supply voltage [v] input offset current [na] . - 40 25 85 1.0v 2.5v 7.0v 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] large signal voltage gain [db] . -6 -4 -2 0 2 4 6 -2.5 -1.5 -0.5 0.5 1.5 2.5 common mode input voltage [v] input offset voltage [mv] - 40 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 12 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 supply voltage[v] slew rate l-h [v/s] ba21 07 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 18. common mode rejection ratio - ambient temperature (vcc/vee=+2.5v/-2.5v) figure 19. power supply rejection ratio - ambient temperature (vcc/vee=+2.5v/-2.5v) figure 20. slew rate l- h - supply voltage figure 21. slew rate h-l - supply voltage 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 supply voltage [v] slew rate h-l [v/s] 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] power supply rejection ratio[db] . 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] common mode rejection ratio [db] . - 40 25 85 - 40 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 13 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx 0 10 20 30 40 50 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 frequency [hz] gain [db] . -180 -150 -120 -90 -60 -30 0 phase [deg] . gain phase ba21 07 (*)the above data is measurement value of typical sample, it is not guaranteed. 10 2 10 3 10 4 10 5 10 6 10 7 figure 22. total harmonic distortion - output voltage (vcc/vee=2.5v/-2.5v, r l =2k 80khz-lpf, t a =25 ) figure 23. equivalent input noise voltage - frequency (vcc/vee=2.5v/-2.5v) figure 24. voltage gain - frequency (vcc/vee=2.5v/-2.5v, av=40db, r l =10k ) 0 10 20 30 40 1 10 100 1000 10000 frequency [hz] input refferd noise voltage [nv/ hz] 0.001 0.01 0.1 1 0.01 0.1 1 10 output voltage [vrms] total harmonic distortion [%] 20khz 1khz 20hz downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 14 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx typical performance curves ba2115 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 2 6. supply current - supply voltage figure 2 8. output voltage - load resistance (vcc/vee=+2.5v/-2.5v) figure 2 5. derating curve figure 2 7. supply current - ambient temperature - 40 25 85 voh vol 0 1 2 3 4 5 6 7 -50 -25 0 25 50 75 100 ambient temperature [ ] supply current [ma] 3.0v 14.0v 5.0v 85 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 ambient temperature [ ] power dissipation [w] . ba2115fvm ba2115f ba2115fj 0 1 2 3 4 5 6 7 0 5 10 15 supply voltage [v] supply current [ma] . -3 -2 -1 0 1 2 3 0.1 1 10 100 1000 10000 load resistance [k] output voltage [v] downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 15 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba2115 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 29. maximum output voltage - supply voltage (r l =10k) figure 31. maximum output voltage - output source current (vcc/vee=+2.5v/-2.5v) figure 32. ma ximum output voltage - output sink current (vcc/vee=+2.5v/-2.5v) figure 30. maximum output voltage - ambient temperature (vcc/vee=+7v/-7v, r l =10k) -10 -8 -6 -4 -2 0 2 4 6 8 10 1 2 3 4 5 6 7 8 supply voltage [v] output voltage [v] voh vol voh vol -10 -8 -6 -4 -2 0 2 4 6 8 10 -50 -25 0 25 50 75 100 ambient temperature [ ] output voltage [v] voh vol 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.4 0.8 1.2 1.6 2.0 output source current [ma] output voltage [v] -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0 2 4 6 8 10 supply voltage [v] supply current [ma] . downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 16 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba2115 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 3 3. input offset voltage - supply voltage (v icm =0v, vout=0v) figure 3 5. input bias curren t - supply voltage (v icm =0v, vout=0v) figure 3 6. input bias current - ambient temperature (v icm =0v, vout=0v) figure 3 4. input offset voltage - ambient temperature (v icm =0v, vout=0v) -6 -4 -2 0 2 4 6 1 2 3 4 5 6 7 8 supply voltage [v] input offset voltage [mv] -3 -2 -1 0 1 2 3 -50 -25 0 25 50 75 100 ambient temperature [c] input offset voltage [mv] 1.5v 2.5v 7.0v 0 50 100 150 200 250 1 2 3 4 5 6 7 8 supply voltage [v] input bias current [na] . . - 40 25 85 0 50 100 150 200 250 -50 -25 0 25 50 75 100 ambient temperature [c] input bias current [na] . 1.5v 2.5v 7.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 17 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx ba2115 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 3 7. input offset current - supply voltage (v icm =0v, vout=0v) figure 3 8. input offset current - ambient temperature (v icm =0v, vout=0v) figure 3 9. input offset voltage - common mode input voltage (vcc/vee=+2.5v/-2.5v, vout=0v) -20 -15 -10 -5 0 5 10 15 20 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 common mode input voltage [v] input offset voltage [mv] -40 -30 -20 -10 0 10 20 30 40 1 2 3 4 5 6 7 8 supply voltage [v] input offset current [na] . - 40 25 85 figure 40. large signal voltage gain - ambient temperature (vcc/vee=+2.5v/-2.5v) 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] large signal voltage gain [db] . - 40 25 85 -40 -30 -20 -10 0 10 20 30 40 -50 -25 0 25 50 75 100 ambient temperature [ ] input offset current [na] 1.5v 2.5v 7.0v downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 18 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 supply voltage[v] slew rate l-h [v/s] ba2115 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 42. power supply rejection ratio - ambient temperature (vcc/vee=+2.5v/-2.5v) figure 41. common mode rejection ratio - ambient temperature (vcc/vee=+2.5v/-2.5v) figure 43. slew rate l- h - supply voltage 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] common mode rejection ratio [db] . 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] power supply rejection ratio [db] . figure 44. slew rate h-l - supply voltage 0 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 supply voltage [v] slew rate h-l [v/s] - 40 25 85 - 40 25 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 19 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx 0 10 20 30 40 50 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 frequency [hz] gain [db] . -180 -150 -120 -90 -60 -30 0 phase [deg] . gain phase ba2115 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 45. total harmonic distortion - output voltage (vcc/vee=2.5v/-2.5v, r l =3k 80khz-lpf, t a =25 ) figure 46. equivalent input noise voltage - frequency (vcc/vee=2.5v/-2.5v) figure 47. voltage gain - frequency (vcc/vee=2.5v/-2.5v, av=40db, r l =10k) 0 10 20 30 40 1 10 100 1000 10000 frequency [hz] input refferd noise voltage [nv/ hz] 0.001 0.01 0.1 1 0.01 0.1 1 10 output voltage [vrms] total harmonic distortion [%] 20khz 1khz 20hz 10 2 10 3 10 4 10 5 10 6 10 7 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 20 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx application information null method condition for test circuit 1 vcc, vee, e k , v icm unit: v parameter v f s1 s2 s3 v cc vee e k v icm calculation input offset voltage v f1 on on off 2. 5 -2.5 0 0 1 input offset current v f2 off off off 2. 5 -2.5 0 0 2 input bias current v f3 off on off 2. 5 -2.5 0 0 3 v f4 on off large signal voltage gain v f5 on on on 2. 5 -2.5 -1.0 0 4 v f6 1.5 -2.5 1.0 0 common-mode rejection ratio (input common-mode voltage range) v f7 on on off 1. 5 -3.5 -1.0 0 5 v f8 3. 5 -1.5 1.0 0 power supply rejection ratio v f9 on on off 0.75 -1.25 0 0 6 v f10 7. 0 -7.0 0 0 -calculation- 1. input offset voltage (vio) 2. input offset current (iio) 3. input bias current (ib) 4. large signal voltage gain (av) 5. common-mode rejection ration (cmrr) 6. power supply rejection ratio (psrr) figure 48. test circuit1 (one channel only) v io |v f1 | = 1+r f /r s [v] |v f5 -v f6 | a v = e k (1+r f /r s ) [db] 20log = cmrr |v f8 -v f7 | v icm (1+r f /r s ) [db] 20log = i b |v f4 -v f3 | 2 r i (1+r f /r s ) [a] i io |v f2 -v f1 | r i (1+r f /r s ) [a] = = psrr |v f 10 C v f9 | v cc (1+ r f /r s ) [db] 20log v cc r f =50k r i =1 0k r s = 50 r l sw 2 500k 500k 0.1 f e k + 15v dut v ee 50k v icm sw1 r i =1 0k v f r s = 50 1000pf 0.1 f - 15v null sw3 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 21 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx cs=20 log 100 out1 out2 r2=100k r1=1k vcc vee out1 =0.5vrms v in r1//r2 v vcc vee out2 r2=100k r1//r2 r1=1k v other ch switch condition for test circuit 2 sw no. sw1 s w2 sw3 sw4 sw5 sw6 sw7 sw8 sw9 sw10 sw11 sw12 sw13 sw14 supply current off off off on off on off off off off off off off off maximum output voltage(high) off off on off off on off off on off off off on off maximum output voltage(low) off off on off off on off off off off off off on off output source current off off on off off on off off off off off off off on output sink current off off on off off on off off off off off off off on slew rate off off off on off off off on on on off off o ff off gain bandwidth product off on off off on on off off on on off off off off equivalent input noise voltage on off off off on on off off off off on off off off figure 49. test circuit 2 (each op-amp) vh vl input wave t input voltage vh vl t v output wave sr = v/t t output voltage figure 50. slew rate input waveform figure 51. test circuit 3(channel separatio n) (vcc=+2.5v, vee=- 2. 5v) 90% 1 0% sw 4 sw 2 sw 3 sw 10 sw11 sw12 sw 9 sw6 sw 7 sw 8 c l sw13 sw 5 r1 c r2 r l v ee vcc v in - v in+ sw14 vout sw1 r s v rl downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 22 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx power dissipation power dissipation(total loss) indicates the power that can b e consumed by ic at t a =25 (normal temperature). ic is heated when it consumed power, and the temperature of ic chip beco mes higher than ambient temperature. the temperature that can be accepted by ic chip depends on circuit configura tion, manufacturing process, and consumable power is limi ted. power dissipation is determined by the temperature allowed in ic chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). the max imum junction temperature is typically equal to the maxim um value in the storage temperature range. heat generated by consumed p ower of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this hea t dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja /w.the temperature of ic inside the package can be estimate d by this thermal resistance. figure 52 . (a) shows the model of thermal resistance of the package . thermal resistance ja , ambient temperature t a , maximum junction temperature t jmax , and power dissipation pd can be calculated by the equation below: ja = (t jmax -t a ) / p d /w ????? ( ) derating curve in figure 52 . (b) indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic with reference to ambient temperatu re. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined b y thermal resistance ja. thermal resistance ja depends on chip size, power consumption, package, ambient temperatu re, package condition, wind velocity, etc even when the s ame of package is used. thermal reduction curve indicates a refere nce value measured at a specified condition. figure 53 . (c),(d ) show a derating curve for an example of ba 2107,ba2115. (note 11) (note 12) (note 13) unit 5.4 6.2 4. 8 mw/ when using the unit above t a =25 , subtract the value above per . permissible dissipation is the value. permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6 mm (cooper foil area below 3%) is mounted. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 ambient temperature [ ] power dissipation [w] . 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 ambient temperature [ ] power dissipation [w] figure 53. derating curve figure 52. thermal resistance and derating curve (c )ba 2107 (d )ba 2115 ba2115fvm (note 13 ) ba2115f (note 12 ) ba21 07g (note 11 ) ba2115fj (note 11 ) ja =( t jmax -t a )/ p d c /w ambient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance (b) derating curve ambient temperature t a [ c ] power dissipation of lsi [w] p d(max) ja2 < ja1 ? ja1 ja1 t j max 0 50 75 100 125 150 25 p1 p2 t jmax ? ja2 ja2 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 23 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx application example voltage follower inverting amplifier non-inverting amplifier figure 54. voltage follower circuit figure 55. inverting amplifier circuit figure 56. non-inverting amplifier circuit voltage gain is 0 db. this circuit controls output voltage (out) equal input voltage (in), and keeps out with stable because of high input impedance and low output impedance. out is shown next expression. out=in for inverting amplifier, vi(b) derating curve voltage gain decided r1 and r2, and phase reversed voltage is output. out is shown next expression. out=-(r2/r1) ? in input impedance is r1. for non-inverting amplifier, in is amplified by voltage gain decided r1 and r2, and phase is same with in . out is shown next expression. out=(1 + r2/r1) ? in this circuit performs high input impedance because input impedance is operational amplifiers input impedance. v ee out in v cc r2 r1 v ee r1//r2 in out v cc v ee r2 v cc in out r1 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 24 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small- si gnal and large-current ground traces, the two ground traces shou ld be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short a nd thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute m aximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin ma y subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins d uring assembly to name a few. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 25 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx operational notes C continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 57 . example of monolithic ic structure 12. unused circuits it is recommended to apply the connection (see figure 58 .) and set the no n-inverting input terminal at a potential within the input common-mode voltage range (v icm ) for any unused circuit. 13. input voltage applying vee +36v to the input terminal is possible without c ausing deterioration of the electrical characteristics or destruction , regardless of the supply voltage. however, this does not ensure normal circuit o peration. please note that the circuit operates normally only when the i nput voltage is within the common mode input voltage range of the ele ctric characteristics. 14. power supply(single/dual) the operational amplifier operates when the voltage sup plied is between v cc and v ee . therefore, the single supply operational amplifier can be used as dual supply operation al amplifier as well. 15. ic handl ing when pressure is applied to the ic through warp on the prin ted circuit board, the characteristics may fluctuate due to the piezo effect. be careful with the warp on the printed circuit boa rd. 16. the ic destruct ion caused by capacitive load the ic may be damaged when vcc terminal and vee terminal is s horted with the charged output terminal capacitor. when ic is used as an operational amplifier or as an appl ication circuit where oscillation is not activated by an o utput capacitor, output capacitor must be kept below 0.1 f in order to prevent the damage mentioned above. vee vcc v icm n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements k eep this potential in vicm figure 58 . example of application circuit for unused op-amp downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 26 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx physical dimension, tape and reel information package name ssop5 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 27 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx physical dimension tape and reel information C continued package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 28 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx physical dimension, tape and reel information package name sop-j8 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 29 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx physical dimension, tape and reel information package name msop8 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 30 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx 0.95 2.4 1.0 0.6 0.95 marking diagrams product name package type marking ba2107 g ssop5 j0 ba2115 f sop8 2115 fj sop- j8 fvm msop8 land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 sop8 1.27 4.60 1.10 0.76 sop- j8 1.27 3.90 1.35 0.76 msop8 0.65 2.62 0.99 0.35 sop8(top view) part number marking lot number 1pin mark ssop5(top view) part number marking lot number msop8(top view) part number marking lot number 1pin mark sop-j8(top view) part number marking lot number 1pin mark ssop5 sop8, sop-j8, msop8 mie ? 2 b2 e downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar0g200090-1-2 ? 201 2 rohm co., ltd. all rights reserved. 31 / 31 11.nov.2014 rev.002 tsz22111 ? 15 ? 00 ba 2107g ba21 15x xx revision history date revision changes 31 .oct.2012 001 new release 11 .nov.2014 002 change in format. addtition of input current item of absolute maximum ratings. (page3) correction of derating curbe of figure 2. (page8) downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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